Most materials absorb UV light easier than infrared, high-energy UV photons directly undermines many of the molecular bonds of non-metallic surface, this "cold" processing out of the parts have smooth edges and minimal charring effect. As the focus on the advantages of UV light, the focal point can be as small as the number of sub-micron level, thus the metal and polymer micro-processing has more advantages, can be a small part of the process; even in the absence of high pulse energy levels, it is also can get a higher energy density, effectively material processing. Superiority has been solid devices, excimer lasers in the ultraviolet, "cold" applications in a dominant position. The green laser pointer company asks the staff members to wear the labor protection appliance during the manufacture process.
However, the excimer technology has many inherent disadvantages: all have to use poisonous gas excimer lasers, and special gases, change, store and process is very cumbersome to adjust while they are bulky, expensive, and maintenance costs * for high; Not only that, the biggest problem is that the output of excimer laser beam large and square, the space of poor quality, which severely limits the beam focus, making the micro-processing must use the mask. Excimer laser drilled on the same step in the shape of the hole and repetitive work is a good (such as the processing of ink-jet printer nozzle holes on the drum), but in general the efficiency is not high, only 1% of the role of pulse energy on the machined surface, and the other about 99% of the light energy loss in the template. The qualification report of green laser pointer is very important to the green laser pointer company.
In addition, the mask method flexibility is limited, if changes need to replace the mask graphics, the whole process must be stopped. Solid UV laser applications has been limited by the output power is not big enough, not able to meet the processing needs. With more reliable diode-pumped solid-state technology, and more reliable mechanism for the development of THG, the situation has changed. The new diode-pumped solid-state laser frequency tripling a competitor excimer laser energy density comparable level, but higher repetition rate, beam quality better. Produced AVIA 355-1500 Coherent semiconductor-pumped solid-state laser output wavelength of 355nm, average power 1.5W, maximum-repetition-rate up to 100kHz, beam quality, ideal for microprocessor applications. Good beam quality. The customer said that if the price of green laser pointer is low enough, their company will add more orders of 200mw laser pointer.
Excellent ability to focus so you can get rid of mask processing by computer-controlled scanning galvanometer beam delivery system to the table in any position), using CAD / CAM software through direct drilling method execution carved, engraved lines or cutting; when the pattern changes, the need to replace hardware. Drilling results show that larger than the focal point of any size and shape of the drilling and cutting can be conducted by repeatedly carving. High repetition rate DPSS lasers is another prominent modern advantages. Excimer laser repetition rate is generally a few hundred hertz, while AVIA heavy frequency of up to 100kHz. High repetition rate applications in low-density and pore size distribution wiring or cutting can greatly improve productivity. Even if the price of this kind of green laser pointer is higher, the customer still select it for its better quality.
For example, in 2 mils (50 microns) thick polyimide materials KaptonTM 30 micron diameter holes drilled approximately 200 pulses, the energy density of 0.2J/cm2. AVIA heavy work in the 50kHz frequency when a second hole can hit about 250, while working at 200Hz repetition rate excimer laser shot under the same parameters of the holes require a full 1 second. AVIA pulse repetition rate from single pulse to 100kHz adjustable, so you can be very fast and flexible control of pulse energy and average power. Use these methods, you can require high processing important initiative to change the processing parameters, such as selective removal of polymer-coated metal, and vice versa. The management personnel of green laser pointer should check the warehouse of green laser pointer carefully.
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