The approval of manufacturing green laser pointer is not that hard to
gain
Brazing a variety of ways, including, laser soldering for printed
circuit board soldering, especially applied to the chip component assembly
technology. Using laser soldering compared to other ways has the following
advantages: because it is local heating, the component is not easy to produce
thermal damage, a small heat-affected zone, near the thermal components to the
purposes of soldering. Non-contact heating, melting bandwidth, does not require
any auxiliary tool can be processed after the double-sided printed circuit board
sided components and equipment. Repeat the operation stability. Pollution of the
flux on the welding tool is small, easy to control, and the irradiation time and
the output power and Laser Brazing high yield. The workshop prepares the new
working table of green laser pointer .
The laser beam is easy to implement
spectral, time and space partitioning can be used semi-lenses, mirrors, prisms,
scanning mirrors and other optical components, to achieve multi-point, while
symmetrical welding. Laser soldering multi-wavelength 1.06um laser as a heat
source, the available optical fiber transmission, it can be processed in the
conventional way is not easy to weld the parts, good flexibility. Focus is good,
easy to implement the automation of multi-bit device. Laser deep penetration.
Metallurgical processes, and process theory. Laser deep penetration
metallurgical physical process is very similar to the electron beam welding, the
energy conversion mechanism is accomplished through the "hole" structure.
Sufficiently high power density beam irradiation, the material to produce the
evaporation of the formation of holes. The approval of manufacturing green laser
pointer is not that hard to gain.
Full steam holes like a bold, almost all
absorbed energy of the incident light, the hole cavity equilibrium temperature
of 25,000 degrees. The heat from high temperature hole cavity outer wall to pass
out, so surrounded by the molten metal of the hole cavity. Holes filled with
wall material in the beam by the continuous evaporation produced high
temperature steam holes walls surrounded by molten metal, liquid metal is
surrounded by surrounded by solid material.
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